Device for oblique angle deposition of materials at nano and micrometric scale using PVD techniques.

Patent

The present invention relates to a device that enables the in-situ deposition of materials at different growth angles from a single evaporation source. The oblique-angle growth of thin-film materials facilitated by this device is based on physical vapor deposition (PVD) processes and is achieved by gradually varying the orientation angle of the substrate surface relative to the material flow from the evaporation source. This device allows for the modification of the growth structure of various materials at the nanoscale and microscale, opening the possibility of studying the influence of these microstructures on the mechanical, optical, thermal, electrochemical, and other properties of thin-film materials.

Sustainable development

The design of this invention allows for the deposition of materials in the form of a thin film at an oblique angle, simultaneously applying a bias voltage to the surface of the substrate on which the material will grow, a procedure that is not possible to carry out in other equipment on the market that uses servo-motors.

Argon ion (Ar+) bombardment generates plasma cleaning, resulting in a contaminant-free surface that improves material adhesion. This allows researchers to study the effect of applying various polarization voltages on the physicochemical, tribological, mechanical, and optical properties of structures deposited at an oblique angle. Ultimately, this invention could open doors for emerging research groups to explore this field, as the device’s design and the materials used in its fabrication make it inexpensive to build.

Marketable Technology/Service: In operation in a real environment, interacting with customers and the market.

University of the Valley

TRL6